From:	NAME: WILLIAM G KENYON              
	FUNC: Chemicals/Electronics           
	TEL: 302-652-4272                     <KENYONWG@A1@ESVAX>
To:	NAME: [log in to unmask] <"[log in to unmask]"@ESDS01@MRGATE@ESVAX>

Check the spec. sheet for compatibility with both IPA and water. 
If both look ok, look at the temperature used for the testing. If 
ambient, then see if elevated temp. testing was done. If not, 
then take a coupon and soak it in hot 75/25 IPA/water for 15 
minutes.  If looks ok, then take a piece with holes in it 
(usually punched), weigh it, soak it and re-weigh. I think you 
will find significant absorption in the punched holes.  The 
IPA/water will come back out with time, but you may see proplems 
resulting from the water and any ionic or non-ionic residues once 
the tested circuit is powered up.
We did some work on single sided punched paper phenolic once, 
soldering with SA flux and then cleaning with CFC solvent. 
Everything looked great, then about 30 min. later looked again 
and saw flux residue had come out of the punched (opened up the 
interior of the board) hole and made a halo around the hole. 
Recleaned, and it looked fine but 30 min later the halo was back. 
SA flux residues did this since they always a thick 
liquid; never solidified at room temperature. Customer went back 
to RA flux, rosin residues solidified and stayed in the matrix, 
so once cleaned it all looked fine.


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