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January 1997

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Subject:
qualification plan for BGA soldering process.
From:
OBRIEN GERARD <[log in to unmask]>
Date:
Thu, 2 Jan 97 17:04:41 -0500
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we would like to change over from QFP's to BGA in our assembly process 
but before doing so I need to define  the reliability test program for 
the assembly process. The environment that the assembly will be used in 
undergoes many thermal excursions during a day, -40C to + 30C is not 
untypical.
Any suggestions regarding a specification that I can use as a starting 
point. The BGA's will be plastic body up to 400 I/O's.

Regards.

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