Dear All:

Our customer is asking us how to implement no-clean assembly process on
Entek Plus Cu-106A from Enthone.Our customer's product is 2 side SMT/BGA
without lead component. Is there anyone help us to get below answer.

1.What kind of no-clean solder paste is most compatible to Cu-106A ?
2.What will the max. storgae time after open bag to assembly? Is there
any concern to store in controlled environment ?
3.Is it necessary to reflow in Nitrogen environment ?
4.What is the max. hold time between first and second IR reflow ?
5.How to rework bad paste printing like skip or misalignment ? 
6.Any other concern using Cu-106 A?

Your input will be highly appreciated.

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