THIRD ANNUAL IPC NATIONAL CONFERENCE - FLEXIBLE CIRCUITS '97
MAY 19-20, 1997 - EMBASSEY SUITES PHOENIX NORTH - PHOENIX, AZ

*********************** CALL FOR PAPERS **********************

Participate in the electronic interconnection industry's most important 
forum dedicated exclusively to flex circuitry. The first two IPC National 
Conferences were a tremendous success, together drawing nearly 400 
industry representatives worldwide. Here is an opportunity for you to 
learn and contribute your expertise.

Papers are sought in all areas including:

New Product Applications**National and World Market Trends**Design 
Strategies for Flex**Material Alternatives** Processing Innovations** 
Fine Line Flex** Increasing Interconnect Density** Flex Assembly** Fine 
Pitch and High Density Packaging for Flex

The two-day IPC National Conference on Flexible Circuits offers time 
slots between 30 minutes and one hour. Some papers may be grouped 
together in a forum or panel discussion.

Presentation materials and papers must be non-commercial in nature, 
focusing on technology rather than a company's product. It is mandatory 
to provide a print-quality paper or hard copies of visuals for the 
conference proceedings in order to deliver an oral presentation. The 
deadline for paper submission is May 2, 1997.

Presenters at the conference will receive full conference admission, 
including refreshments and lunches, and the proceedings at no charge.

To submit an abstract, please respond directly to John Riley, IPC 
Education Director, via e-mail: [log in to unmask] or fax 847/509-9798.
Abstracts should be 200-300 words long. Please indicate length of 
presentation (30, 45, or 60 minutes), title, and if this paper has been 
presented before.

ABSTRACTS ARE DUE PRIOR TO FEBRUARY 2, 1997

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