TECHNET Archives

January 1997

TechNet@IPC.ORG

Options: Use Monospaced Font
Show Text Part by Default
Show All Mail Headers

Message: [<< First] [< Prev] [Next >] [Last >>]
Topic: [<< First] [< Prev] [Next >] [Last >>]
Author: [<< First] [< Prev] [Next >] [Last >>]

Print Reply
Subject:
From:
Date:
Mon, 27 Jan 1997 22:38:43 -0500 (EST)
Content-Type:
text/plain
Parts/Attachments:
text/plain (32 lines)
>I do not discount low temperature ranges--what I discount is the combination
>of low and high temperatures in the same test cycles. This confounds a number
>of different damage mechanisms.
>Sure, cycling assemblies from -55 (or -65) to +125 (or +150) C will give you
>failures fast, but so does dropping them from the Empire State building.
> What do these cycles mean for your product that never sees any cycles even
>remotely close to the test cycles? 

   < snip >

Werner, just a point of reference, we perform a lot of thermocycling test
cycles with both low and high thermal excursions (ie -40 to +125 etc). I
would just like to say that for certain automotive applications (ie under
hood), a thermal excursion of -40 to +125 is not merely feasible, it is
almost certain. Those in doubt merely have to check the temperature here in
Montreal today.

Dave Rooke
Circo Craft - Pointe Claire

***************************************************************************
* TechNet mail list is provided as a service by IPC using SmartList v3.05 *
***************************************************************************
* To unsubscribe from this list at any time, send a message to:           *
* [log in to unmask] with <subject: unsubscribe> and no text.        *
***************************************************************************
* If you are having a problem with the IPC TechNet forum please contact   *
* Dmitriy Sklyar at 847-509-9700 ext. 311 or email at [log in to unmask]      *
***************************************************************************



ATOM RSS1 RSS2