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January 1997

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Subject:
Soldermask peeling
From:
Alistair Murray <[log in to unmask]>
Date:
Mon, 27 Jan 97 11:09:16 +0000
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I refer to problems experienced by Andrew Buonviri. Some of the present 
families of "No Clean" flux contain a higher alcohol content than those 
of their predecessors. Under certain conditions, they can attack even the 
best of prepared boards. It may be due to the lower solids content which 
reduces the thermal barrier. I think you may need to talk to your 
assembler and his flux supplier.


Alistair F. Murray
Artetch Circuits Ltd
U.K.

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