Hi Technetters:
  
  Any help on these two questions would be appreciated:
  
  1. Our contractor is using WS-609 solder paste from alphametals for 
  double-sided process. The board is cleaned after each side process before 
  going to the next side. My question is: is it necessary to clean after each 
  side process? can it be cleaned only once after the assembly? 
  
  2. Does anyone know a SMT version for a cap, 228, M, 25V, AL, 18DX15M, 
  2200uF?
  
  Thanks in advance!
  
  Yuan Li
  Exabyte

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