David Bergman,
I'm interested in this topic, too. How can I email to Lisa ?
Pls help, thank you.
Rgds,
Shirley Ng
Material Engineer
Motorola Penang
Email : csn007.email.mot.com
_______________________________________________________________________________
To: Ian Wylie
Cc: [log in to unmask]; [log in to unmask]; solberg
From: David Bergman on Fri, Jan 17, 1997 3:26
Subject: Re: Design Standards for BGA
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Date: Thu, 16 Jan 1997 12:02:51 -0600 (CST)
From: David Bergman <[log in to unmask]>
Subject: Re: Design Standards for BGA
To: Ian Wylie <[log in to unmask]>
cc: [log in to unmask], [log in to unmask], solberg <[log in to unmask]>
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JEDEC concentrates their efforts on the component and the I/O pitch. IPC
is responsible for developing the associated land patterns. We are in
the process of developing land patterns for BGA as part of IPC-SM-782A.
You can contact Lisa Williams of IPC's staff to determine the current status.
Regards
__________________________________________________
David W. Bergman, V.P. of Technical Programs
IPC
2215 Sanders Road
Northbrook, IL 60062-6135
847-509-9700 x340 Phone
847-509-9798 Fax
email [log in to unmask]
www http://www.ipc.org
faxback support 800-646-0089
---------------------------------------------------
On Tue, 14 Jan 1997, Ian Wylie wrote:
> Hello out there can anybody help me ?
>
> I am interested in any info on design rule and footprint standards for BGA
> devices. ?
>
>
> Are there any Jedec Standards that cover this.?
>
> Regards
> Ian Wylie
> Technical Manager
> Ian Wylie
> Technical Systems Manager
> Exacta Circuits Ltd
> Printed Circuit Manufacturers
> Selkirk
> Scotland TD7 5EJ
> 00 44 1750 21601 Ext 3219
>
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