I am curious, about the manufacturing of rigid/flex circuits. 

At our shop, we currently are not looking into any type of technology
similar to this.  I would like to know the considerations of working
with a process such as this. 

I have heard that the lamination  technique is somewhat different than
conventional rigid multilayer processing. Also, another difference I
have heard is the registrationing of the flex to rigid.

I would appreciate if someone could give me some insight on rigid/flex
processing.

Thanks in advance

T. Gaylor 

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