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January 1997

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Subject:
Re: FAB: Clean before solder mask
From:
[log in to unmask] (John E Nelson)
Date:
Tue, 7 Jan 1997 21:09:33 PST
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If you're not careful you'll have a lot in common with Hawk Chen.

I've tested various pre-clean processes prior to soldermask (LPI and dry
film)
over the years including:

	microetch with persulfate
	microetch with peroxide/sulfuric
	microetch with peroxymonosulfates
	'scotch brite' type scrub
	'brushlon' type scrub
	'scotch brite' type scrub followed by microetch
	microetch followed by Entec CU-56

None compares with pumice scrub for adhesion.

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