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Date: | Thu, 23 Jan 97 05:06:17 cst |
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Hi Carey -
SOT-23 - these little buggers are have been driving a great many folks
crazy almost as bad as leadless chip carriers! We have experienced
some problems with reflow soldering this component type but after some
investigation we found that we had a flux/thermal interaction problem.
Because the SOT-23's pads were connected to several internal board
layers they were slow to heat up and we were not getting good flux
activation during the reflow cycle. We solved the problem by slowing
down the conveyor to allow for a better preheat soak. If you do slow
down your conveyor speed be careful not slow down too much and
overheat the flux (i.e. burn it off) or you will experience problems
too. Good Luck.
Dave Hillman
Rockwell Collins
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______________________________ Reply Separator _________________________________
Subject: Soldering Profiles
Author: [log in to unmask] at ccmgw1
Date: 1/22/97 9:35 PM
We are experiencing problems with a Hewlett Packard PIN diode component
during wave soldering
The HP part is a HSMP-3810 in low profile SOT-23 package (marking EOL) If
the component is Hand soldered it performs to it's specifications. If it is
IR re-flowed the part suffers form a performance degradation (not complete
failure)
HP has refused ( is either unwilling or unable) to provide a preferred
soldering profile for this part
Has one experienced this problem with other low profile SOT-23 type device,
or knows of a IR profile that can be safely used with this part.
Regards
Carey Ritchey
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