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January 1997

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Subject:
From:
Bob Willis <[log in to unmask]>
Date:
02 Jan 97 03:23:05 EST
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As we all know there are problems with solder balling on solder resist during
wave soldering in both air and nitrogen. Today many suppliers of masks state
that they will be solder ball FREE resists !!!!!!

Well its time to do the first real production trial via Technet and SMART E
LINK. SMART is Europe's Largest Electronics Trade Association.

Like other trials conducted by the SMART Group the information will be freely
available to any engineers for future reference and should be of particular
interest to printed board fabricators.

I have a solder balling test pattern for any solder mask suppliers who would
like to have a Free evaluation of there mask under standard wave soldering
conditions. Well its over to the solder mask suppliers lets see what is the best
solder resist on the market and are ball FREE resist available.

All the test results of this trial will be provided on Technet for other
engineers to consider. The IPC criteria will be used as a reference for
acceptability and be assessed by members of the SMART Group.


Bob Willis
Honorary Vice President SMART Group
Process Engineering Consultant
Electronic Presentation Services
2 Fourth Avenue, Chelmsford, Essex CM1 4HA. England.
Tel: (44) 01245 351502
Fax: (44) 01245 496123
Home Page: http://ourworld.compuserve.com/homepages/Bwillis
Email: [log in to unmask]


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