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Date: | Wed, 29 Jan 97 12:05:39 MST |
Content-Type: | text/plain |
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Hello,
Please post information, experiences, and anecdotes, on using
electroplated gold as an etch resist. In particular how is the etch
rate controlled. How can the undercut be reduced to eliminate the
chance of slivers.
(Gold/Nickel/Copper/FR4 :The copper gets etched)
Thanks
Rich
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