Subject: | |
From: | |
Date: | Fri, 24 Jan 97 17:14:28 MDT |
Content-Type: | text/plain |
Parts/Attachments: |
|
|
Hi Technetters:
Any help on these two questions would be appreciated:
1. Our contractor is using WS-609 solder paste from alphametals for
double-sided process. The board is cleaned after each side process before
going to the next side. My question is: is it necessary to clean after each
side process? can it be cleaned only once after the assembly?
2. Does anyone know a SMT version for a cap, 228, M, 25V, AL, 18DX15M,
2200uF?
Thanks in advance!
Yuan Li
Exabyte
***************************************************************************
* TechNet mail list is provided as a service by IPC using SmartList v3.05 *
***************************************************************************
* To unsubscribe from this list at any time, send a message to: *
* [log in to unmask] with <subject: unsubscribe> and no text. *
***************************************************************************
* If you are having a problem with the IPC TechNet forum please contact *
* Dmitriy Sklyar at 847-509-9700 ext. 311 or email at [log in to unmask] *
***************************************************************************
|
|
|