Dumb question. Why not double coat white marking ink over the green solder
mask?
Dave Rooke
Circo-Craft - Pointe Claire
__________________
>I still have not been able to locate a source for white thermal cure
>soldermask for FR-4 boards. Legend ink will not suffice; I need the
>dielectric qualities of "real" soldermask. I do not have satisfactory
>dry-film or LPI capabilities. I have a captive shop with special
>applications where I need a white surface.
>thanks,
>[log in to unmask]
>
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------------------------------
Date: Wed, 15 Jan 1997 15:08:25 +0100
From: Antoni Cherta <[log in to unmask]>
To: [log in to unmask]
Subject: BGA's machines
Message-Id: <[log in to unmask]>
Content-Type: text/plain; charset="us-ascii"
Hi guys,
I have a customer interested in introduce BGA's in his production process.
It seems that he coulkd be interested in adquire some equipment to plce them.
Actually, big p&p machines are offered with a large costes and they have
prohibited prices.
Do you know any small equipment for small productions, to offer to my customer?.
I know OK Industries equipments and at this moment, they seem the ideal for
place and remove the BGA's.
Does any body know an alternative product?. If yes, please contact me for
models and prices. I could be interested in take your representative for
Spain and South France.
Waiting for your comments.
Best regards
_ _
( -0-0- )
--o00o---\o/---o00o--
ANTONI CHERTA
E-mail:
[log in to unmask]
Fax: + 34.3.274.00.80
BARCELONA
-----------------
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------------------------------
Date: Wed, 15 Jan 1997 15:08:16 +0100
From: Antoni Cherta <[log in to unmask]>
To: [log in to unmask]
Subject: Nepcon West'97
Message-Id: <[log in to unmask]>
Content-Type: text/plain; charset="us-ascii"
Hi guys,
Does anybody can, confirm me dates for Nepcon West 97 in Anaheim (CA)?
I supose that it is on February 23-25th but I've not received their typical
invitation.
Best regards,
_ _
( -0-0- )
--o00o---\o/---o00o--
ANTONI CHERTA
E-mail:
[log in to unmask]
Fax: + 34.3.274.00.80
BARCELONA
-----------------
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------------------------------
Date: Wed, 15 Jan 1997 07:33:00 -0600
From: "Max Bernhardt "<[log in to unmask]>
To: TechNet <[log in to unmask]>
Subject: RE: ASSY: Pre-tinning of Gold Leads
Message-Id: <[log in to unmask]>
Content-Type: text/plain; charset="us-ascii"
Content-Transfer-Encoding: 7bit
Gold and Tin do not mix in Solder. In fact, studies done by the
military actually show a degradation in reliability for gold plated
parts that have been soldered into a board. My guess is that when the
vendor tins the gold leads, the gold evaporates and you would be hard
pressed to find any of it even if you scraped the tin off. Therefore,
the guidelines that I would follow would be the industry standard on the
thickness of tin plated leads of components
Hope this helps
Max Bernhardt
Woodward Governor Co.
----------
From: Rajan, Sanjay
To: technet
Subject: ASSY: Pre-tinning of Gold Leads
Date: Tuesday, January 14, 1997 1:45PM
Technetters
We use a lot of components that come with gold plated
leads (gull wing, J-leaded, castellations..). We are currently
asking our vendors to pre-tin these leads if possible and one
such vendor wants to know the exact mil-spec that he can
look up to know the thickess of the tinning that is required.
Can anyone point me to the exact document that spits out
recommended tinning thicknesses based on the thickness
of the gold on the lead??
Thank you
________________________________________________
Sanjay Rajan RF Communications Division
Harris Corporation Product Design Engineering
1680 University Avenue Phone: (716) 242-3923
Rochester, NY 14610 Fax: (716) 242-3174
________________________________________________
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------------------------------
Date: Wed, 15 Jan 1997 22:26:59 +0800
From: tonghh <[log in to unmask]>
To: [log in to unmask]
Subject: Photo-initiation
Message-Id: <[log in to unmask]>
Content-Type: text/plain; charset="us-ascii"
At 5.00pm 150197 , a supplier of soldermask ink informed me that different
ink have different composition of photo-initiator and because of the variation
in the amount of photo-initiator it contains , a lower exposure energy is
required
for those with high level of phot-initiator and vice versa .
Although majority of soldermask ink supplier TDS mentioned an approximate
300mj/cm2
of exposure energy needed during the process of photo- initiation ,sometimes
this
does not work . Any comments is much welcome .Thanks .
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------------------------------
Date: Wed, 15 Jan 1997 08:55:35 +600 CDT
From: "Luis Rivera" <[log in to unmask]>
To: [log in to unmask], [log in to unmask]
Subject: Re: cleaners for RMA flux
Message-Id: <[log in to unmask]>
This E-Mail addresses the section of Doug Paul's response to Ellen
Bekrman that mentions the Labeling Law.
Ellen, the EPA established a hotline in early 1993 when the labeling
law went into effect, it is (800) 296-1996. I just called the number
and it is still active.
Please feel free to contact me directly if there is interest in
knowing how we and many of our customers responded to the labeling
regulation (40 CFR Part 82 - Protection of Stratospheric Ozone).
Best regards,
Luis Rivera
CompuRoute, Inc.
Dallas, TX
[log in to unmask]
(214) 340-0543
> From: [log in to unmask]
> Date: Tue, 14 Jan 1997 16:00:32 -0500 (EST)
> Message-Id: <[log in to unmask]>
> To: [log in to unmask]
> Subject: Re: cleaners for RMA flux
>
> << For those of you who still use RMA flux - what are you using to clean
> your
> boards? Should boards being cleaned with HCFCs be labelled (Montreal
> Protocol)?
>
> Ellen Berkman
> Excalibur Systems >>
>
> Ellen,
> Our lab deals with a wide variety of processes, including low solids, water
> solubles, and traditional high solids RMAs, usually from a residue
> standpoint. There are still a wide variety of processes being used and a
> number of manufacturers are remaining with high solids RMAs, due to the
> protection afforded by all that rosin. Most of the customers that we deal
> with who are still using HCFCs are looking to get out of them quickly. The
> increasingly hard line taken by the EPA on HCFCs makes this a very
> unattractive option. You would have to contact the EPA to determine if HCFC
> cleaned assemblies are included in the CFC Labelling Law. Perhaps another
> individual on this forum could comment on that aspect. I don't deal with the
> Labelling Law much.
A segment of Doug's response E-Mail was left out for brevity purposes.
Luis
>
>
> Doug Pauls
> Technical Director
> Contamination Studies Labs
> [log in to unmask]
> (317) 457-8095
> EIEIO
>
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--------------------------------
End of TechNet-d Digest V97 Issue #30
*************************************
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