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From [log in to unmask] Mon Jan 27 17: |
28:19 1997 |
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Brett,
Set up your AOI to inspect the dishdowns. If it is a reflective AOI unit it
should be able to detect these defects without affecting other inspection
parameters such opens/shorts/etc. You can then keep track of frequency and
note any patterns or repeatability of occurrance.
I don't know if there is any industry data supporting dishdowns, however,
there may be some information in the IPC Operator Awareness Videos for PWB
etching(IPC-OA-111) or PWB Inspection(IPC-OA-117.)
George Murray
Gerber Systems
----------
From: TechNet-request
To: TechNet
Subject: FAB-Dish downs in copper circuits
Date: Monday, January 27, 1997 10:24AM
Good Morning,
Recently a customer had a field failure in which and internal circuit
trace
burned through. After a failure analysis was done, a cross-section
determined
that at the point of failure there was a dish-down or vertical thinning of
the trace.
This defect was not picked up at innerlayer inspection as the primary
focus
is on shorts, breaks and mouse-bites. The customer would like to know if
there
is any industry data showing the possible frequency of such a defect.
How do I give a cause/corrective action for a defect Im not sure I can
consistantly
detect?
Thank you for your help.
Brett Austin
Nationwide Circuits Inc
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