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| From [log in to unmask] Fri Jan 24 13: |
45:52 1997 |
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Marshall:
Not to hedge, but it depends. If you are in Arizona in the summer you
could probably leave it out for a week, but in Florida in the summer 1
hour could be to long. It really depends on the ambient conditions.
To be on the safe side the rigid-flex should be baked 1 hr @ 250 F
prior to solder operation. If you need to leave out for a period of
time after bake, leave parts under a heat lamp.
Regards,
Ron Yanuszewski
______________________________ Reply Separator _________________________________
Subject: Assy: Rigid Flex
Author: [log in to unmask] at !INTERNET
Date: 1/24/97 2:00 AM
What is the maximum period of time that a rigid-flex board consisting of
glass reinforced polyimide board and polyimide flex, can be left out of the
dry box on the assembly floor before it should be re-baked to insure that it
will not blister or de-laminate?
Thanks in advance for helping clear up a discussion between a board supplier
and an assembler.
Marshall Andrews
[log in to unmask]
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