Technetters:
I have a couple of questions and would appreciate
any input...
1. What is the JEDEC/IPC spec on lead coplanarity
for QFP's?
2. Can anyone recommend any tinning houses that would
tin surface mount packages for us? I know one such place
is Corfin, are there any other popular ones?
Thank you
________________________________________________
Sanjay Rajan RF Communications Division
Harris Corporation Product Design Engineering
1680 University Avenue Phone: (716) 242-3923
Rochester, NY 14610 Fax: (716) 242-3174
________________________________________________
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