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| From [log in to unmask] Fri Jan 10 15: |
04:35 1997 |
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Bill has a great point! I would like to expand on it a bit........
The optimal process utilizes material properties to calibrate the profiling
system. If you use the solder alloy which you are reflowing to secure the T/C to
a particular pad, there will be a flat spot (transition temperature) in your
profile. Then secure the T/C down in another area with epoxy. Chip bonder works
great. This may alter your actual temperature ever so slightly.
PS - it did clear as well as confuse ISO auditors who could not understand
properties of materials!
Enjoy the tip,
Allen
_______________________________________________________________________________
Subject: Re: ASSY: thermocouple adhesive
From: [log in to unmask] at ftl03
Date: 1/10/97 1:04 PM
Why not use solder its better !
Bob Willis
Process Engineering Consultant
Electronic Presentation Services
2 Fourth Avenue, Chelmsford, Essex CM1 4HA. England.
Tel: (44) 01245 351502
Fax: (44) 01245 496123
Home Page: http://ourworld.compuserve.com/homepages/Bwillis
Email: [log in to unmask]
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