TECHNET Archives

1996

TechNet@IPC.ORG

Options: Use Monospaced Font
Show Text Part by Default
Show All Mail Headers

Message: [<< First] [< Prev] [Next >] [Last >>]
Topic: [<< First] [< Prev] [Next >] [Last >>]
Author: [<< First] [< Prev] [Next >] [Last >>]

Print Reply
Subject:
From:
Date:
Tue, 2 Jan 96 16:53:27 PST
Content-Type:
text/plain
Parts/Attachments:
text/plain (12 lines)
I am interested in data and/or a test technique that ages and 
determines the solderability of an electroless Ni/immersion Au process. 
 My primary area of interest is ageing techniques tried and the 
associated reliability of the solderability results.

Randy Reed
Merix Corporation
503.359.9300  X4421
[log in to unmask]



ATOM RSS1 RSS2