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1996

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Thu, 21 Mar 96 12:20:23 EST
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     Mike, we ran into a similar problem here a few years ago. Our solution 
     was to assemble complete, spray RMA flux on both sides, place in an 
     inert atmosphere over @ 240 deg F for 4 hrs, let cool then process 
     through the normal flow soldering process. 
     
     Gary Santavicca
     Nothrop Grumman Corp
     Manufacturing Services


______________________________ Reply Separator _________________________________
Subject: Re: ASSY
Author:  [log in to unmask] at Internet
Date:    3/21/96 10:36 AM


Mike, I would ditto Jerry Cupples remarks. However, I  have some additional 
concerns about possible blistering caused by moisture absorption over the 
years. Baking would help that, but baking can also increase any oxidation 
problems.
     
You definitely have a challenge on your hands.
     
Good luck
     
Charlie Barker
Input/Output, Inc.
713/276-3328
     
To: TechNet @ ipc.org @ Internet
cc:  (bcc: Charles Barker/IO-US)
From: mcussen @ medar.com (Mike Cussen) @ Internet 
Date: 03/15/96 07:38:03 AM
Subject: ASSY
     
 I have a six layer board (FR4) that has been setting on the shelf for three 
 years, and not stored in  plastic bags. 
 What would be your recommendation to assure that these boards would solder 
 properly, when processed?
     
     
 Thanks In Advance
 Michael Cussen
 Medar Inc.
 mcussen@medar
     
     
     



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