Please help me resolve a design issue.

The board will be assemblied using solderpaste, pick and place, surface
mount assembly (both sides).  The design has .0135" vias hole centers less
than .030" from surface mount pads.  The via and pad is connected with a
short .008" wide trace.  There is no soldermask dam between the surface
mount pad and the via hole.  Board is a 4 layer .062, which has soldermask
already on the board.

Any assembly concerns?  Should there be a soldermask dam between the land
and via?  What guidelines do you use/like ?

Thanks for your input


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                           George Franck
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