The following documents are now published and available from IPC:

J-STD-020: Moisture/Reflow Sensitivity Classification for plastic 
Integrated Circuit Surface Mount Devices.  $20 member/$40 non
"The purpose of this test method is to identify the classification level 
of plastic IC Surface Mount Devices (SMDs) that are sensitive to 
moisture-induced stress so that they can be properly packaged, stored, 
and handled to avoid subsequent mechanical damage during assembly solder 
reflow attachment and/or repair." Supersedes IPC-SM-786 and JEDEC 
JESD22-A112.

IPC-3408: General Requirements for Anisotropically Conductive Adhesive Films.
$10 members/$20 non
"This document covers requirements and test methods for anisotropically 
conductive adhesive films used to bond and electrically connect components 
and for their long-term properties as a part of the printed wiring board 
assembly.  Applications include the following: flexible PWB-to-glass, 
flexible PWB-to-rigid PWB, flip chip-to-glass, flip chip-to-flexible PWB, 
flip chip-to-rigid PWB, and fine pitch SMD.  The adhesive film may be 
supplied pre-attached to a flexible circuit or other product."  "This 
standard defines anistropically conductive adhesive films (also known as 
Z-axis films, ZAF) through specification of test methods and inspection 
criteria."


if you have any questions, please send an email or call Doug Sandvick at 
IPC, 847/509-9700, ext. 393.

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