> but if you want to go to ENAu you will have to change your wave solder
> parameters to get good solder rise in the through holes. ENAu requires
> more heat to get a Ni/Pb/Sn intermetallic and the gold dissolving in
the
> solder as it rises up the hole, slows down the rate of wetting. There
are
> some options to help this:
> preheat 100 C +10-0, solder temp 235C, speed 1.2m/min, contact time
with
> wave 4 secs, spray fluxer but ensure that flux reaches the top of the
> through holes.
>
> Dougal Stewart,
> Exacta Circuits Scotland

Hi Dougal,
How thick is the gold-board to use with that profile?
Anyway, we need to have more than 4 secs contact time (approx 5-8 secs),
speed of 0.7m/min (upto as slow as 0.4m/min), solder temp 245C, preheat
120C +10-0 and ofcourse a spray application.

/Jan Merstrand

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