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Tue, 17 Dec 96 16:50:48 PST
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[log in to unmask] (James Edwards) Wrote:
| 
| Could someone tell me the advantages of using Gold/NI vs HASL 
| and
| what are the common (if any) process problems I may encounter 
| when
| screening/placing parts/soldering to these type boards using
| 63/37 eutectic solder paste? Any wave solder issues? Thanks 

James,

The August 1995 edition of Electronic Packaging & Production has a paper 
titled as "Alternatives to HASL:  A Uer's Guide For Surface Finishes", 
which gives a pretty summary on alternative PCB surface technology, 
including Ni/Au.  It also include a comparison chart for HASL, Ni/Au, OSP, 
Matte Tin in terms of fine pitch capability, electrical contact, cost and 
etc.

Qun Xiao

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