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1996

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Tue, 19 Nov 1996 14:42:05 +0000
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The attributes we monitor in SPC'ing our wave solder process are 
bridges, blow holes, icicles, insuf. top and bottom, excess, pin 
holes, protrusion, and grainy solder.  The first, middle and last 
boards of most runs are SPC'd, and the number of defects compared to 
the Maximum In-Control Defects ( MICD) for that particular part 
number.  The operator stops the process any time the MICD is
exceeded, for correction of the process.  

The MICD for each part number is computer-calculated, and the charts are 
also generated by VAX computer.  We get charts of dpm, q index, a
Pareto, and a data table.

I can provide copies of these charts and/or a copy of the Statistical 
Process Control Instruction for this process.

Lynn Roberts
817/234-6914
fax 817/234-6735

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