TECHNET Archives

1996

TechNet@IPC.ORG

Options: Use Monospaced Font
Show Text Part by Default
Show All Mail Headers

Message: [<< First] [< Prev] [Next >] [Last >>]
Topic: [<< First] [< Prev] [Next >] [Last >>]
Author: [<< First] [< Prev] [Next >] [Last >>]

Print Reply
Subject:
From:
Date:
Tue, 19 Nov 96 15:34: 0 PST
Content-Type:
text/plain
Parts/Attachments:
text/plain (21 lines)
Hi technetter,

I would like to have some feedback on how a "not approved" BGA solder joint look like" (except 
for an open or bridge). I am referring to eutectic collapsable solder joints.

Can you have "too fat" or "too thin" joints?

Hans Bogren

Ericsson Telecom AB
Sweden   

***************************************************************************
* TechNet mail list is provided as a service by IPC using SmartList v3.05 *
***************************************************************************
* To unsubscribe from this list at any time, send a message to:           *
* [log in to unmask] with <subject: unsubscribe> and no text.        *
***************************************************************************



ATOM RSS1 RSS2