FINAL REMINDER CALL FOR PAPERS--We still have room for a few good technical
non-commercial presentations at The 21st Annual Electronics Manufacturing
Seminar in Ridgecrest, California on 19-21 February 1997. Suggested subject
areas) are:  Advanced Assembly Techniques (COB/EPT/BGA/Flip Chip),
Acquisition Reform, Automated Inspection, Cleaning Processes, Components
(Mil Spec/Commercial), Environmental Issues, Non-Governmental Standards/
Commercial Standards for Process Control, Printed Wiring Board/ Assembly
Materials (Fluxes/Solder/Adhesives/Conformal Coatings), Material
Qualification and Use, Reliability Issues, Solderability, Solderability
Processes. Solder Alternatives, and Training Issues.Two presentation formats
will be utilized -- Technical Paper , 40 minutes in length and Technical
Brief -  5 to 10 minute.If you are interested, call Mel Parrish, MTTC, or
Jerry Maurice, NAWCWD ar 619-446-5571 now. 
 Regards Doug Whitnell

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