TECHNET Archives

1996

TechNet@IPC.ORG

Options: Use Monospaced Font
Show Text Part by Default
Show All Mail Headers

Message: [<< First] [< Prev] [Next >] [Last >>]
Topic: [<< First] [< Prev] [Next >] [Last >>]
Author: [<< First] [< Prev] [Next >] [Last >>]

Print Reply
Subject:
From:
Maurice Dore * <[log in to unmask]>
Date:
Fri, 25 Oct 96 11:58:00 GMT
Content-Type:
text/plain
Parts/Attachments:
text/plain (24 lines)


What is the detrimental effects over different periods of time on the 
solderability of HASL PCBs due to uncontrolled humidity and temperature.
I have seen 5/10 Micron plating reduced to 0.8 Micron due to bad storeage.
What is the effects of different humidity and temperatures on the stored 
PCBs after different lengths of time?
Has  there been any research into this?
Any suggestions/opinions appreciated.

Thanks in advance.

Moss Dore
AMT Ireland

***************************************************************************
* TechNet mail list is provided as a service by IPC using SmartList v3.05 *
***************************************************************************
* To unsubscribe from this list at any time, send a message to:           *
* [log in to unmask] with <subject: unsubscribe> and no text.        *
***************************************************************************



ATOM RSS1 RSS2