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1996

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Subject:
From:
Bob Poirier <[log in to unmask]>
Date:
Wed, 23 Oct 1996 08:25:17 -0700
Content-Type:
text/plain
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text/plain (35 lines)
During transit and the time delay between shipping from the PCB
manufacturer and solder processing during assembly, the PCB may have
a tendency to absorb water which can create blistering of the solder
mask during soldering. Baking the PCB prior to soldering eliminates this
problem. Proper storage of the PCB may also eliminate the need to bake.

Bob Poirier, Technical Specialist, Solder Masks
Morton Electronic Materials

>>> Wolfgang ERAT <[log in to unmask]> 10/23/96 07:16am
>>>
There is no reason to bake a properly processed PCB. Baking prior to
assembly is used with mixed succeess to hide weaknesses of the
board. It also affects solderability. Can you tell me why your customer is
asking you to bake ?

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