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| Date: | Fri, 11 Oct 96 14:17:35 EDT |
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FROM: I. MEMIS, DEPT GGMG/BLDG 257-4, AISLE A, ENDICOTT
ENDICOTT ELECTRONIC PACKAGING
SUBJECT: Alloy 42 TSOP Solder Joint Cracks
Assuming that non-cracked joints are made in the assembly process, the
fatigue life of these joints is limited. We have successfully used a
backfill approach to resolve that problem. If anyone wants details,
please contact me.
Irving Memis
607-755-6022
IBM Endicott
[log in to unmask]
Irv Memis
USERID: MEMISIRV, NODEID: ENDVM5, TEL: 855-6022 FAX: 857-1126
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