Mr. Tansey:

Thank you for your inquiry.  The method used in the study was (Total 
Number of Defects) / (Sum of components and solder joints).  We did not 
ask companies to submit other methodologies, so I don't have additional 
information on that for you.

I have cc:'d 
this correspondence to the IPC TechNet as well to generate additional 
responses/additional methodologies.  (To subscribe to the TechNet to see 
the responses, send an e-mail to [log in to unmask]; Subject: 
Subscribe).  (This is a free service).

In response to your request to participate next year, your company at 
your location must be a member of the IPC.  If you let me know at which 
Williams Electronics you are located, I can let you know your member 
status.  

Kim Sterling
Director, Market Research
IPC
2215 Sanders Road
Northbrook, IL 60062
Phone 847/509-9700 ext 305
FAX 847/509-9798
E-Mail [log in to unmask]


On Thu, 10 Oct 1996 [log in to unmask] wrote:

> Kim,
> I read the Circuit Assembly web page article about the IPC study on pcb
> assembly houses and would like to be involved in the next study if possible.
>  Is it also possible to obtain the various methods companies track defects
> rates?  I would like very much to compare our methods to those of other
> companies in the world.
> 
> Thank you,
> James Tansey
> [log in to unmask]
> Quality Assurance Director-Amusement Games
> Williams Electronics Games
> 
> 

***************************************************************************
* TechNet mail list is provided as a service by IPC using SmartList v3.05 *
***************************************************************************
* To unsubscribe from this list at any time, send a message to:           *
* [log in to unmask] with <subject: unsubscribe> and no text.        *
***************************************************************************