You might discover an increase in tombstoning components attributed to the
amount of surface tension of the reflowed solder versus the relative weight
of the component.  Often times one of the component pads may reflow a split
second prior to the other pad, and the resulting surface tensions may shift/
and or tilt the component up.  These problems can be worked out by finding the
proper combination of reflow process, and component pad geometry.  Some
manufacturers seem to use component pads that are reduced at the component ends
to help reduce the outward surface tension.  Good luck.

                                                          Steve A

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