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1996

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Subject:
Assy: Ball Grid Array
From:
[log in to unmask] (TIM MENDENHALL)
Date:
Tue, 24 Sep 1996 16:26:58 -0500
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     We are currently establishing our BGA process and have several 
     questions:
     
     1. What is an acceptable amount of times a BGA device can be
        reworked, reballed, and remounted? 
     
     2. What are the critical elements to consider and why?
     
     3. What is the maximum number or percentage of solder voids allowed    
        per solder joint (bump) connection?
     
     4. Has IPC released a BGA standard?
     
     
     Tim Mendenhall (QA)
     Hitachi
     Email: [log in to unmask]
        

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