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Date: | Sat, 14 Sep 1996 23:28:43 +0800 |
Content-Type: | text/plain |
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Hi Pat,
Try printing with a 8 or 7 mil thick stencil, it works a lot better on 0805
component. And you need not worry so much with mssing dot, too little
or too much. The stencil opening is a slot with dimension of 1.25 X 0.5 mm.
I am using loctite 3607.
I, sometimes mix the printing process with dispensing process ...
Poh Kong Hui
Nera Electronics
------------------------------------------------------------------------------
At 01:56 PM 9/11/96 -0500, you wrote:
>Hello:
>
>We have a new design that has 0805s on the bottom of a board that will be
>wave soldered. We have done 1206s for years but our dot for the 1206s is
>too large for the 0805s.
>
>We have a Camalot w/ a rotary displacement pump doing the dispensing. It
>has a mechanical z-axis compensator which allows me to set the height of the
>needle above the board - but not on the fly (micrometer adjustment). We
>cure the adhesive in an IR oven.
>
>I could use some advise. I'm looking for answers to these questions:
>Please don't feel like you have to answer all of them, respond to as many
>(or as few) as you would like.
>
>1) What adhesive have you been able to acheive good results with? What is
>it's rated viscosity if you happen to know it?
>2) What needle diameter do you use?
>3) Do you try to achieve a dot 2x the needle diameter? If not, what size
>dot do you strive for?
>4) What is the height of the needle above the PCB?
>5) What air pressure do you use (do you have a rotary displacement pump)?
>6) Do you use a different size dot for 1206s on the same board. If so, how
>do you achieve the larger dot?
>
>Thanks for any help. I really appreciate it.
>
>-Pat-
>
>-------------
>Patrick McGuine
>Nicolet Instrument
>[log in to unmask]
>(608) 276-6334
>
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Poh Kong Hui
Nera Electronics
Fax: (65) 7765492
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