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1996

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Subject:
From:
"D.C.Whalley" <[log in to unmask]>
Date:
Tue, 10 Sep 1996 14:32:04 -0400
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Chris Bailey from Greenwich University is building models of formation
of through hole solder joints. These detailed models include the coupled
phsical processes of cooling, solidification & residual stress development.

These types of model should increase understanding of defect formation.

The results from Chris's models look very encouraging, but in
order to check the assumptions made regarding the initial temperature
distribution in the assembly and the heat transfer out of the assembly,
he needs some real thermal history data for comparison.

Does anyone have any data they are prepared to share? The sort of thing he
needs are time temperature plots for solder joints, for PCB top and bottom
side and for the components.


David Whalley

Loughborough University

http://info.lut.ac.uk/departments/en/RESEARCH/MP/mp-dcw.html

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