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1996

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From:
"Greg Bartlett" <[log in to unmask]>
Date:
22 Aug 1996 14:31:46 -0400
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                      RE>assy:Immersion gold finishes              8/22/96

Stephen,

We had some boards which had been spec'ed to be immersion gold over electroless nickel with which we had limited success, as well.  When we did some in-depth checking, however, we discovered that it was actually electrolytic gold over electrolytic nickel, and in places the gold thickness was in the several hundred microinch range (as opposed to 3-8 for immersion).  We attribute the soldering difficulties to this.  

In the limited tests that we have performed with i.Au/e.Ni, we've had great success soldering with conventional soldering chemistries and processes.

Regards,
Greg Bartlett
Mercury Computer Systems
Chelmsford, MA  
[log in to unmask]
--------------------------------------
Date: 8/22/96 2:07 PM
To: Greg Bartlett
From: STEPHEN WELDON

   I am currently venturing into the world of pcb metallic finishes.  I have acquired some pcb's with immersion gold on them and have met with what seems to be limited success.  I was wondering if there are any tricks of the trade for processing these style boards thru a conventional SMT/Wave solder process?  If a different formulation other than 63/37 solder paste is recommended? and who it stacks up to the OSP coatings?


	Stephen Weldon
	Manufacturing Engineer
	Diagnostic Instrument Co.
	[log in to unmask]


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