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1996

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Subject:
From:
[log in to unmask] (David M Fulmer)
Date:
Wed, 21 Aug 1996 14:06:29 PST
Content-Type:
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Topic:	Surface moisture affecting operational amplifier output
drift on a FR-4 multi-layer PCB.
	(board layup) -  1).  component layer,   2).  ground plane,   3).
 power plane,  4). solder side layer

Question:	When shielding the input pins of an operational
amplifier with guard rings, is it recommended to 
	expose the guard traces (solder over tin reflow), rather than
covering them with solder mask ?

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