I am working with a high-temp (> +175degC) soldering process which 
     requires that the plating and or coatings be removed/stripped from 
     component leads. This leaves the base metal (copper) exposed and then 
     we "tin" using production solder (high Pb-based alloy) to within one 
     lead diameter of the component body. (Don't want to expose the 
     component body to the molten solder within the solder pot due to 
     thermal shock and/or fatigue to component).
     
     Here's the question:
     
     1) What effects (corrosion, etc.) would we see if we left the 
     component lead base metal (copper) exposed at extended high temp with 
     the potential of moisture present ? 
     
     Any papers, and or technical resources avalibale that may address this 
     issue ?
     
     Thanks,
     
     D.Drake

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