You need to verify the footprint of the component! Are they compatabile to 
IPC-SM-782? Reduce the width of the pads will also help.  Of course, the 
problem can be vendor related.

Thanks
Michael Yuen
 ----------
From: TechNet-request
To: technet
Subject: ASS: Cracking of Decoupling Caps
Date: Monday, August 07, 1995 9:26AM

I have a mixed technology board - bottom side smt  power supply which is
failing. I suspect that the failure is due to the unreliability of
decoupling ceramic caps.
On reworking the caps they tend to crack.
I have subjected them to thermal shock tests and they seem to retain their
 integrity.
Any suggestions? Is it a vendor problem (which seems unlikely) only?
Thanks in advance.

***************************************************************************
* TechNet mail list is provided as a service by IPC using SmartList v3.05 *
***************************************************************************
* To unsubscribe from this list at any time, send a message to:           *
* [log in to unmask] with <subject: unsubscribe> and no text.        *
***************************************************************************