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1996

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Subject:
From:
RICK VERNON <[log in to unmask]>
Date:
Wed, 31 Jul 1996 10:50:23 -0500
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	We are preparing to purchase a GPD CF-15 component prepping
machine. This machine uses a roller method to form leads.
	The die set for 0.040" to 0.060" dia. leads forms the lead with a
radius of 0.045". This radius is less than what is specified in IPC-A-610B
section 3.3, Table 3.3. The machine vendor has told our MFG Engineer
that this is the way "many" assembly houses prep components. I am
concerned on the reliablility of prepping to such a tight radius on the large
lead.
	Does anyone have experience with this type of machine relating
to IPC specified bend radius values? We can prep to Class 2 with the
exception of several large lead diameter parts. I would handle this case
with a statement that would exclude the large lead parts.

Thanks for any information provided.
Rick Vernon, QA Engineer, Phoenix International Corp.

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