One of our customers, Smiths Industries in Basingstoke, Hants, has the 
following query:

"We have a problem of short circuits and eventual burning of pcb's caused by 
dendritic growth of copper between internal copper planes and via pads. The 
dendritic filaments follow the glass fibre weft and warp.

Is there an IPC document describing this phenomena, and are there standard 
tests for checking the susceptability of FR4 boards?

The conditions are military; +95 deg C to -50 deg C, four cycles per day with 
up to 100% humidity. Boards are populated and conformally coated."

Apologies for any inaccurate transcribing.

We will pass on any help proffered to him (he is not on e-mail, poor chap!)
Regards,
Peter

I-I-I-I-I-I-I-I-I-I-I-I-I-I-I-I-I-I-I-I-I-I-I-I-I-I-I-I-I-I-I-I-I-I-I-I-I-I-I-I
Peter Swanson                                         Oxfordshire, England
Dynamix Technology Ltd, IPC/UK
[log in to unmask]                         Compuserve: 100120,3641
          http://ourworld.compuserve.com/homepages/Peter_Swanson

      If it weren't for the last minute, nothing would ever get done.
I-I-I-I-I-I-I-I-I-I-I-I-I-I-I-I-I-I-I-I-I-I-I-I-I-I-I-I-I-I-I-I-I-I-I-I-I-I-I-I

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