To: IPC; PCBFab
From: Lee-CTUA065 Bab-Hui on Mon, Jul 15, 1996 8:29 AM
Subject: %P in electroless Ni

Hello,

This question is directed to all who are using electroless Ni/immersion gold 
as PCB surface finish for solderability application. Anyone has done any 
study on the effect of %P content in the electroless Ni deposits on the 
solderability & bonding strength as far as assembly is concerned? What is 
the recommended range of %w/w P content? What is the "dangerous" level? Hope 
somebody can shed some light on this issue.

Regards,
B.H.Lee
Process Engineer

Motorola Electronics Pte Ltd
Printed Circuit Board Operations
76, Pioneer Road
Singapore 639577
Republic of Singapore

Fax: ++65-8630233
e-mail: [log in to unmask]  

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