Does anyone have information or data on what chemical control limits are
required (specific gravity, pH, temperature, etc.) to maintain a constant etcher
conveyer speed for a given copper plating thickness such as 1 oz base and 1 mil
electroplated Cu?  We have done a lot of testing and tried a lot of control
schemes.  Nothing seems to work reliably.  We still etch one piece,  measure the
line width, adjust the conveyor speed accordingly and then run the lot.

Hans Rohr.  

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