YOU ARE CORDIALLY INVITED
to attend our 3rd Annual E / T Program on: Wednesday, February 7, 1996 - 5:00 p.m. - 9:00 p.m.
Location: Holiday Inn - Maingate, 1850 S. Harbor Blvd.
Anaheim, California
Cost: $7.00 - RSVP (714) 665-6625
by Tues., February 6, 1996
This program is an excellent opportunity for engineers and
other technical personnel in Southern California to evaluate
and compare the latest emerging technologies for advanced
electronic packaging.
"Emerging Technologies 1996" is designed for broad appeal
and should be of interest to electrical engineers, electronic
packaging engineers, mechanical engineers, software engineers,
manufacturing engineers, sales / marketing specialists, and
technical managers.
Abstracts of Technical Presentation
Low Cost, Robust Sensors Based on Advanced Thick Film Technology
Speaker: Dr. Boris Kamentser, President,
Bokam Engineering, Inc., Santa Ana, California.
Dr. Kamentser immigrated to the United States in 1978 and has authored
and patents in the flow measurement field in both the
United States and in the former U.S.S.R
Advances in thick film technology have led to a new approach in
the design of sensors and transducers. This approach utilizes a
screen-printing process that permits printing of strain gauges directly
onto the surface of the sensing element. The result is a stable, robust
transducer produced at low cost. Dr. Kamentser will discuss the particulars
of thick film technology, the guidelines for the design of the sensing element
and signal processing electronics, and temperature compensation metholds.
Various applications for the new transducer product line will be reviewed,
particularly ones for the automobile industry, computer manufacturing, and
jet engine testing.
Microelectromechanical Systems (MEMS) and Micromachining Technology"
Speaker: Dr. C.J. Kim, Assistant Professor,
Mechanical / Aerospace Engineering, UCLA, Los Angeles, Ca.
Dr. Kim conducts research activities on MEMS including design and fabrication
of microstructures, microactuators and sensors, microthermal and fluid
devices, mechanics in microscale, and non-conventional manufacturing.
Microelectromechanical Systems (MEMS) have become one of the fastest
growing, most visible fields in the world. Evolved from the integrated
circuit fabrication community, most of the MEMS devices, which are produced as
silicon chips, face unique packaging challenges due to the moving elements on
the chips. Dr. Kim will present an overview of micromachining technologies
for MEMS, discuss examples of current commercial products using MEMS, and
review the on-going MEMS research at UCLA.
Monolithic Microwave HEMT-HBT Integrated Circuits"
Speaker: Dr. Dwight C. Streit, Technical Fellow, Microelectronic Products
& Technology, TRW Space & Electronics Group, R. B., Ca.
Dr. Steit is a TRW Technical Fellow and the principal investigator
for monolithic HEMT-HBT integrated circuits and for semiconductor materials
research and development.
High performance GaAs - based microwave circuits have historically used
either high electron mobility transistors (HEMTs) or heterojunction bipolar
transistors (HBTs), but not both types of transistors in the same integrated
circuit. TRW has achieved the successful monolithic integr- ation of HEMTs
and HBTs in the same microwave circuit, thus creating an entirely new class
of microwave circuits that can achieve functions and performance not
currently available using existing single - device technologies. Dr. Streit
will discuss the endless design opportunities when both HEMT and HBT are
available on the same chip and how monolithic integration of microwave and
digital functions can significantly improve receiver performance.
Please direct e-mail questions to Bill Gaines, [log in to unmask]
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Information about the IEPS may be obtained via e-mail at [log in to unmask]
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