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1996

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Subject:
From:
"Edwards, Ted A (AZ75)" <[log in to unmask]>
Date:
20 Jun 1996 17:36:37 -0500
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Test data shows the Aramid material is one of the type materials that picks 
up moisture that needs to be removed before assembly operations where the 
board sees temperatures where water is converted to steam. Steam occupies 
much more volume than water and this causes blistering, delamination and 
other not nice effects on the PWB
 ----------
From: [log in to unmask]
To: [log in to unmask]
Subject: ASSY: Aramid material and baking
Date: Thursday, June 20, 1996 2:22PM

     Please forgive my ignorance, but what are the undesirable effects 
     from not baking Aramid material prior to assembly?
        [log in to unmask]



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