Hello Neal - OSPs are not OSPs! There are several products available 
     on the market and they all have various degrees of thermal excursion 
     durability. The type of reflow environment (nitrogen or not) and 
     cleaning system (for say a double pass assembly that gets cleaned 
     between reflow passes) are factors to consider too. Send an email on 
     which specific OSP you are using and we can discuss.
     
     
     Dave Hillman
     Rockwell Collins
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Subject: Assembly:  OSP and Bake.
Author:  [log in to unmask] at ccmgw1
Date:    6/18/96 7:15 PM


     
     Anyone pre-baking prior to the wave with OSP on the boards.  Time and 
     Temp?  Seems I heard about an oxidation of the Cu under the OSP, or 
     was the T & T too much?  Question comes up because of the necessity to 
     bake things such as Thermount boards prior to any temp. stressing.  
     
     Thanks, Neal Preimesberger, HMSC Tucson.  520-794-1030
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