Although J-STD-001 (revisions A and B) states that assemblies should be 
preheated prior to exposure MOLTEN solder. (It doesn't mention reflow.)
It further states: "The preheat temperature must not degrade printd 
boards, components, or soldering performance."

Obviously, the process for prebake is assumed to be site-specific.

Mike Buetow
IPC Technical Staff
2215 Sanders Road
Northbrook, IL 60062
P: 847-509-9700, ext. 335
F: 847-509-9798
[log in to unmask]


On Tue, 18 Jun 1996, teik wrote:

>      A customer of ours is asking what is the best practice baking 
>      procedure (or pre-conditioning) of loaded board prior to IR reflow or 
>      wave soldering.
>      
>      All of our specs in house deal with bare boards. I know there must be 
>      an IPC assy spec that specifies boards pre-conditioning at reflow. Can 
>      someone tell me the spec#, temperature and duration?
>      
>      Thanks.
>      
>      Teik M. Ng
>      [log in to unmask]
>      PC World
>      Toronto, Canada
> 
>