A customer of ours is asking what is the best practice baking 
     procedure (or pre-conditioning) of loaded board prior to IR reflow or 
     wave soldering.
     
     All of our specs in house deal with bare boards. I know there must be 
     an IPC assy spec that specifies boards pre-conditioning at reflow. Can 
     someone tell me the spec#, temperature and duration?
     
     Thanks.
     
     Teik M. Ng
     [log in to unmask]
     PC World
     Toronto, Canada