We are investigating the feasibility of a software tool to predict 
the reflow soldering profile. As input we want amount and type of 
components, print parameters (thickness, layers, area etc.). As output:
conveyor speed, the different temperatures and convection % for our
hot air reflow machine.

Does anybody know tools that can accomplish this? If not, are you 
interested in the results or do you just want that bright and shiny 
solder joints (target condition class 3)?


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 Ivo de Rooij (off-line)           Manufacturing Process Engineer SMT/THT
                   
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 Fokker Elmo BV                 Electric and Electronic Aerospace Systems                
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